IIARD International Institute of Academic Research and Development

International Journal of Engineering and Modern Technology (IJEMT )

E-ISSN 2504-8848
P-ISSN 2695-2149
VOL. 10 NO. 5 2024
DOI: 10.56201/ijemt.v10.no5.2024.pg10.31

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Application of Optimised Models in Heat Sink Environments for Heat Transfer. A Review

UCHEGBU Chinenye Eberechi, FAGBOHUNMI, Griffin Siji

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Abstract

Many difficulties in most electrical designs arise from the challenges of electronic components overheating, particularly switching devices, and the incapacity of the heat sink to effectively limit this thermal effect. Proper heat sink environment design can lead to proper electrical component design. In addition to taking into account different heat sink compositions and architectures, this study also examined how rectifier diode resistance affects heat generation. Because the surface temperature is not constant, it will always be uncomfortable, according to the stability and transient study that was done. Both the plate surface and the rib surface exhibit variations in it. Radiators that are long typically have a wide variation in surface temperature. The radiator's upper sections receive less cooling and have less ability to absorb heat. The majority of heat sink types were designed and structured using Matlab/Simulink as an analysis tool based on their structural shape and composition. A steady and transient model was described using Matlab/Simulink, and the project's output demonstrates that heat absorption can be increased in any material by selecting the appropriate heat sink structure.

keywords:

Matlab, Radiator, Heat Sink, Thermal Effect, Diode Resistance, Heat Transfer, Mosfet, Heat Distribution Module, Thermal Resistance.

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References:

Ali HM, Arshad A (2017) Experimental investigation of n-eicosane-based circular pin-fin heat
sinks for passive cooling of electronic devices. Int J Heat Mass Transf 112:649–661
Ali HM, Ashraf MJ, Giovannelli A, Irfan M, Irshad TB, Hamid HM, Hassan F, Arshad A (2018)
Thermal management of electronics: an experimental analysis of triangular, rectangular,
and circular pin-fin heat sinks for various PCMs. Int J Heat Mass Transf 123:272–284
Bahiraei M, Heshmatian S, Goodarzi M, Moayedi H (2019) CFD analysis of employing a novel
ecofriendly nanofluid in a miniature pin fin heat sink for cooling of electronic components:
effect of different configurations. Adv Powder Technol 30(11):2503–2516
Chen K, Xing J, Wang S, Song M (2017) Heat source layout optimisation in two-dimensional heat
conduction using the simulated annealing method. Int J Heat Mass Transf 108:210–219
Dammak K, El Hami A (2021) Thermal reliability-based design optimisation using the Kriging
model of a PCM-based pin fin heat sink. Int J Heat Mass Transf 166:1–21
Denga T, Rana Y, Yina Y, Liu P (2020) Multi-objective optimisation design of thermal
management system for lithium-ion battery pack based on non-dominated sorting genetic
algorithm II. Appl Therm Eng 164:1–11
Durgam S (2021) Forced convection from IC chips on printed circuit boards generating high heat
fluxes. J Inst Eng (India): C 102(4):933–940
Durgam S, Sundararajan T (2019) Conjugate forced convection from heat sources on substrates of
different thermal conductivities. J Thermophys Heat Transf 33(4):1–13
Durgam S, Venkateshan SP, Sundararajan T (2019) Effect of thermal conductivity on cooling of
a square heat source array under natural convection in a vertical channel. Heat Transf Eng
41(11):949–960
Esmaeili H, Armaghani T, Abedini A, Pop I (2019) Turbulent combined forced and natural
convection of nanofluid in a 3D rectangular channel using a two-phase model approach. J
Therm Anal Calorim 135(6):3247–3257
Farzanehnia A, Khatibi M, Sardarabadi M, Passandideh-Fard M (2019) Experimental
investigation of multiwall carbon nanotube and paraffin-based heat sinks for electronic
device thermal management. Energy Convers Manage 179:314–325
Fukuie K, Iwata Y, Iwase E (2018) Design of substrate stretchability using origami-like folding
deformation for flexible thermoelectric generator. Micromachines 9(7):1–8
Grand View Research (2023) Thermal management technologies market analysis by product
(hardware, software, interface, substrates), by application (computers, consumer
electronics, telecommunication, automotive electronics, renewable energy), and segment
forecasts to 2024, Market Analysis Report. https://www.grandviewresearch.com/industryanalysis/thermal-management-technologies-industry
Hadavand M, Yousefzadeh S, Akbari OA, Pourfattah F, Nguyen HM, Asadi A (2019) A numerical
investigation on the effects of mixed convection of Ag-water nanofluid inside a simcircular lid-driven cavity on the temperature of an electronic silicon chip. Appl Therm Eng
162:1–45
Haghighi SS, Goshayeshi HR, Safaei MR (2018) Natural convection heat transfer enhancement in
new designs of plate-fin-based heat sinks. Int J Heat Mass Transf 125:640–647
Hotta TK, Balaji C, Venkateshan (2015) Experiment-driven ANN-GA-based technique for
optimal distribution of discrete heat sources under mixed convection. Exp Heat Transf
28(3):298–315
Ikeda S, Nagai T (2018) Development of an optimisation method for a heat source and a chart for
operational design using a genetic algorithm and lagrange multiplier. Jpn Archit Rev
2:280–291
Ikhlaq M, Yasir M, Demiro?lu M, Arik M (2021) Synthetic jet cooling technology for electronics
thermal management—a critical review. IEEE Trans Compon Packag Manuf Technol
11(8):1156–1170
Jiaqiang E, Han D, Qiu A, Zhu H, Deng Y, Chen J, Zhao X, Zuo W, Wang H, Chen J, Peng Q
(2018) Orthogonal experimental design of liquid cooling structure on the cooling effect of
a liquid cooled battery thermal management system. Appl Therm Eng 132:508–520
Karimi G, Li X (2013) Thermal management of lithium-ion batteries for electric vehicles. Int J
Energy Res 37(1):13–24
Krishna VM, Kumar MS (2019) Numerical analysis of forced convective heat transfer of nanofluids in micro-channels for cooling electronic equipment. Mater Today Proc 17:295–302
Lai Y, Wu W, Chen K, Wang S, Xin C (2019) A compact and lightweight liquid-cooled thermal
management solution for cylindrical lithium-ion power battery packs. Int J Heat Mass
Transf 144:1–37
Lin Z, Liu H, Li Q, Liu H, Chu S, Yang Y, Chu G (2018) High thermal conductivity liquid metal
pad for heat dissipation in electronic devices. Appl Phys A 124:1–6
Lutsenko NA (2018) Numerical model of two-dimensional heterogeneous combustion in porous
media under natural convection or forced filtration. Combust Theor Model 22(2):359–377
Lv Y, Liu G, Zhang G, Yang X (2020) A novel thermal management structure using serpentine
phase change material coupled with forced air convection for cylindrical battery modules.
J Power Sources 468:1–9
Mathew VK, Hotta TK (2018) Numerical investigation on optimal arrangement of IC chips
mounted on a SMPS board cooled under mixed convection. Therm Sci Eng Prog 7:221–
229
Mathew VK, Hotta TK (2019) Role of PCM based mini-channels for the cooling of multiple
protruding IC chips on the SMPS board-a numerical study. J Energy Storage 26:100917
Mebarek-Oudina F (2017) Numerical modelling of the hydrodynamic stability in a vertical annulus
with heat sources of different lengths. Eng Sci Technol 20(4):1324–1333
Murshed SS (2016) Introductory chapter: electronics cooling—an overview. Electron Cool 1–
11. https://doi.org/10.5772/63321.
Patil NG, Hotta TK (2020) A combined numerical simulation and optimisation model for the
cooling of IC chips under forced convection. Int J Mod Phys C 31(3):1–37
Peterson GP, Ortega A (1990) Thermal control of electronic equipment and devices. Adv Heat
Transf 20:181–314. Elsevier
Purusothaman A (2018) Investigation of natural convection heat transfer performance of the QFNPCB electronic module by using nano-fluid for power electronics cooling applications.
Adv Powder Technol 29:996–1004
Putra N, Ariantara B (2017) Electric motor thermal management system using L-shaped flat heat
pipes. Appl Therm Eng 126:1156–1163
Qin P, Liao M, Mei W, Sun J, Wang Q (2021) Experimental and numerical investigation of a
hybrid battery thermal management system based on forced air convection and internal
finned structure. Appl Therm Eng 195:1–14
Qin P, Liao M, Zhang D, Liu Y, Sun J, Wang Q (2019) Experimental and numerical study on a
novel hybrid battery thermal management system integrated forced air convection and
phase change material. Energy Convers Manage 195:1371–1381
Qiu Y, Garg D, Zhou L, Kharangate CR, Kim S-M, Mudawar I (2020) An artificial neural network
model to predict mini/micro-channel saturated flow boiling heat transfer coefficient based
on universal consolidated data. Int J Heat Mass Transf 149:1–19
Sarper B, Saglam M, Aydin O (2018) Experimental and numerical investigation of natural
convection in a discretely heated vertical channel: effect of the blockage ratio of the heat
sources. Int J Heat Mass Transf 126:894–910
Selimefendigila F, Oztop HF (2020) Mixed convection in a PCM-filled cavity under the influence
of a rotating cylinder. Sol Energy 200:61–75
Sharma A, Tyagi VV, Chen CR, Buddhi D (2009) Review on thermal energy storage with phase
change materials and applications. Renew Sustain Energy Rev 13:318–345
Sheng L, Su L, Zhang H, Li K, Fang Y, Ye W, Fang Yu (2019) Numerical investigation on a
lithium ion battery thermal management utilising a serpentine channel liquid cooling plate
exchanger. Int J Heat Mass Transf 141:658–668
Tian Z, Gan W, Zhang X, Gu B, Yang L (2018) Investigation on an integrated thermal management
system with battery cooling and motor waste heat recovery for el

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